Surface Processing Technologies
Product-specific grinding is available in our grinding processes with double or single layer options. We can work at the micron levels in parallelism and flatness; as for thickness tolerances, we can work within 0.02 mm.
In the lapping processes, precision surface processing is possible up to Ra 0.1 surface parameters; as for thickness tolerances, we can work within 0.001 mm. We can reach 1-5 micron values in double surface parallelism, depending on the product range.
Following the grinding and lapping processes, we can perform trimming, de-burring, and chamfering operations on the relevant products.